EP4CGX50DF23C8N vs EP4CGX50DF23C7N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF23C8N von Intel und EP4CGX50DF23C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50DF23C8N | EP4CGX50DF23C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $56,40 | $43,20 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps |
| Gehäuse | 484-ball FBGA (DF23) | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) |
| Ball Pitch | 1.00 mm | — |
| Seated Height | 2.40 mm | — |
| Terminal Form | Ball | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Configuration Modes | JTAG, Passive Serial, Active Serial | Passive Serial (PS), Active Serial (AS), JTAG |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (168 hours) | 3 (168 hours) |
| RoHS-Status | Compliant | Compliant (Pb-free variant) |
| Total RAM Bits | — | 2,432 Kbit (≈ 304 KB) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 2 |
| Global Clock Networks | — | 8 (with up to 16 clock pins per region) |
| Number of I/O Pins | — | 290 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Betriebstemperatur | — | 0 °C to 85 °C (commercial) |
| Supported Memory Interfaces | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |