EP4CGX50DF23C8N vs EP4CGX50DF23C7N Comparación
Comparación detallada lado a lado de EP4CGX50DF23C8N por Intel y EP4CGX50DF23C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50DF23C8N | EP4CGX50DF23C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $56,40 | $43,20 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Up to 8 channels, 3.125 Gbps |
| Encapsulado | 484-ball FBGA (DF23) | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) |
| Ball Pitch | 1.00 mm | — |
| Seated Height | 2.40 mm | — |
| Terminal Form | Ball | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Configuration Modes | JTAG, Passive Serial, Active Serial | Passive Serial (PS), Active Serial (AS), JTAG |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 (168 hours) | 3 (168 hours) |
| Estado RoHS | Compliant | Compliant (Pb-free variant) |
| Total RAM Bits | — | 2,432 Kbit (≈ 304 KB) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 2 |
| Global Clock Networks | — | 8 (with up to 16 clock pins per region) |
| Number of I/O Pins | — | 290 |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Temperatura de funcionamiento | — | 0 °C to 85 °C (commercial) |
| Supported Memory Interfaces | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |