EP4CGX50DF23I7N vs EP4CGX110DF23I7N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF23I7N von Intel und EP4CGX110DF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50DF23I7N | EP4CGX110DF23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $105,20 | $182,00 |
| Series | Cyclone IV GX | — |
| Family | Cyclone IV | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | — |
| Embedded Memory | 2,562 Kbit | 4.4 Mbits (approximate) |
| Number of Logic Cells | 49,888 | — |
| Process Technology | 60 nm | 60 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum User I/O Pins | 290 | — |
| Number of Transceivers | 8 (3.125 Gbps) | — |
| Gehäuse | 484-ball FBGA (BGA-484) | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.00 mm | — |
| Operating Temperature (Industrial) | -40 C to +100 C | — |
| Speed Grade | I7 | 7 |
| Number of PLLs | 4 | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 109,424 |
| Logic Array Blocks (LABs) | — | 6,839 |
| User I/O Pins | — | 270 |
| Embedded 18x18 Multipliers | — | 56 |
| Transceivers | — | Up to 3.125 Gbps embedded transceivers |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Betriebstemperatur | — | -40C to +100C (industrial) |
| Package Code | — | BGA (FBGA) |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |