EP4CGX50DF27C6N vs EP4CGX50DF27C7 Vergleich
Detaillierter Direktvergleich von EP4CGX50DF27C6N von Intel und EP4CGX50DF27C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50DF27C6N | EP4CGX50DF27C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $155,00 | $49,10 |
| Family | Cyclone IV GX | — |
| Logic Elements (LE) | 49,888 | — |
| Logic Array Blocks (LAB) | 3,118 | — |
| Embedded Memory | 2,562,048 bits (~313 Kbyte) | — |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 140 | — |
| User I/O Pins | 310 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | 8 channels up to 3.125 Gbps |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C6 (commercial) | C7 (commercial) |
| Process Technology | 60 nm low-power | 60 nm |
| Gehäuse | 672-ball FineLine BGA (FBGA) | 672-ball FBGA (F27) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Montageart | Surface Mount | Surface Mount (FBGA) |
| RoHS-Status | Compliant | Compliant |
| Device Family | — | Cyclone IV GX |
| Logic Elements | — | 49,888 |
| Logic Cells | — | 49,888 |
| Embedded Memory Bits | — | 2,562,048 |
| Total RAM Bits | — | 2,562,048 (256 K x 8 / 32 K x 36 typical) |
| User I/O | — | 310 |
| Pins / Balls | — | 672 |
| MSL-Level | — | 3 (168 hours) |
| Multipliers (DSP blocks) | — | [DATA_NEEDED: dedicated hardware multiplier count] |