EP4CGX50DF27C6N vs EP4CGX50DF27C7N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF27C6N von Intel und EP4CGX50DF27C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50DF27C6N | EP4CGX50DF27C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $155,00 | $58,60 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | 49,888 |
| Logic Array Blocks (LAB) | 3,118 | [DATA_NEEDED: LAB count for EP4CGX50] |
| Embedded Memory | 2,562,048 bits (~313 Kbyte) | — |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 140 | — |
| User I/O Pins | 310 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Yes (3.125 Gbps GX channels, package-dependent) |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C6 (commercial) | — |
| Process Technology | 60 nm low-power | — |
| Gehäuse | 672-ball FineLine BGA (FBGA) | 672-pin FBGA (FineLine BGA) |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Total Embedded Memory Bits | — | 2,562,048 |
| User I/O Pins (max) | — | 310 |
| Core Supply Voltage | — | 1.2 V |
| Process Node | — | 60 nm |
| Operating Temperature (Commercial 'C') | — | 0C to +85C |
| PLL Count | — | 6 |
| Hard Memory Controller | — | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| Lead-Free | — | Yes |