EP4CGX50DF27I8N vs EP4CGX75DF27I7N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF27I8N von Intel und EP4CGX75DF27I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50DF27I8N | EP4CGX75DF27I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,90 | $58,75 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 | — |
| Embedded Memory (bits) | 2,562,048 | — |
| Embedded Memory Blocks | 250 x M9K | — |
| 18 x 18 Multipliers | 200 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | 310 | — |
| Transceiver Channels | 8 (up to 3.125 Gbps) | — |
| PCI Express Hard IP | Gen1 x1/x2/x4 | — |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Gehäuse | 672-ball FineLine BGA (F27) | FBGA-672 (27 mm) |
| Speed Grade | 8 (fastest) | — |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | Compliant |
| Device Model | — | EP4CGX75 |
| Logic Elements (LE) | — | 73,920 |
| Embedded Memory | — | 4,257,792 bits (M9K blocks) |
| User I/O Count | — | 310 |
| Supply Voltage - Core | — | 1.2 V |
| Betriebstemperatur | — | -40C to +100C (Industrial, I7) |
| Number of Transceivers | — | 8 channels |
| Transceiver Data Rate | — | 3.125 Gbps |
| Hard PCIe Block | — | Gen1 x1/x2/x4 (PIPE) |
| Number of PLLs | — | 8 |
| Number of I/O Banks | — | 8 |
| Configuration Modes | — | JTAG, AS, AP, PS |