EP4CGX50DF27I8N vs EP4CGX75DF27I7N Comparación
Comparación detallada lado a lado de EP4CGX50DF27I8N por Intel y EP4CGX75DF27I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50DF27I8N | EP4CGX75DF27I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,90 | $58,75 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 | — |
| Embedded Memory (bits) | 2,562,048 | — |
| Embedded Memory Blocks | 250 x M9K | — |
| 18 x 18 Multipliers | 200 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | 310 | — |
| Transceiver Channels | 8 (up to 3.125 Gbps) | — |
| PCI Express Hard IP | Gen1 x1/x2/x4 | — |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| I/O Bank Voltages | 1.0 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Encapsulado | 672-ball FineLine BGA (F27) | FBGA-672 (27 mm) |
| Speed Grade | 8 (fastest) | — |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Estado RoHS | Compliant | Compliant |
| Device Model | — | EP4CGX75 |
| Logic Elements (LE) | — | 73,920 |
| Embedded Memory | — | 4,257,792 bits (M9K blocks) |
| User I/O Count | — | 310 |
| Supply Voltage - Core | — | 1.2 V |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial, I7) |
| Number of Transceivers | — | 8 channels |
| Transceiver Data Rate | — | 3.125 Gbps |
| Hard PCIe Block | — | Gen1 x1/x2/x4 (PIPE) |
| Number of PLLs | — | 8 |
| Number of I/O Banks | — | 8 |
| Configuration Modes | — | JTAG, AS, AP, PS |