EP4CGX75CF23C6N vs EP4CGX75CF23I7N Vergleich

Detaillierter Direktvergleich von EP4CGX75CF23C6N von Intel und EP4CGX75CF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4CGX75CF23C6N EP4CGX75CF23I7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $99,00 $165,30
Series Cyclone IV GX EP4CGX75 (F23)
Family EP4CGX75 Cyclone IV GX
Logic Elements (LE) 73,920 73,920
Embedded Memory (Bits) 4,257,792 (approx. 4.27 Mbit) —
Embedded Memory Blocks M9K memory blocks —
Embedded 18x18 Multipliers 150 —
User I/O Count 290 —
Number of Transceivers 8 (integrated, up to 3.125 Gbps) —
PLLs 4 8
Gehäuse 484-FBGA (FineLine BGA) 484-FBGA (F23), 23 x 23 mm, 1.0 mm pitch
Betriebstemperatur 0C to +85C (Commercial) -40C to +100C (industrial I7 grade)
Speed Grade 6 —
Configuration Modes JTAG, Active Serial (AS), Passive Serial (PS) Active Serial, Passive Serial, JTAG, Fast Passive Parallel
Process Technology 60 nm low-power CMOS —
Supply Voltage - Core 1.2 V (typical) —
RoHS-Status Compliant Lead-free (compliant per datasheet.com excerpt)
Transceiver Data Rate (max) 3.125 Gbps —
Configurable Logic Blocks (CLBs) — 4,620
Embedded Memory — 4,257,792 bits (316 M9K blocks)
Embedded Multipliers (18x18) — 150
User I/O Pins — 290
Transceivers — 8 channels up to 3.125 Gbps
Montageart — Surface Mount (FBGA)
Process Node — 60 nm low-power
MSL-Level — 3 (per typical Altera FBGA)

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