EP4CGX75DF27C7 vs EP4CGX75CF23I7 Vergleich
Detaillierter Direktvergleich von EP4CGX75DF27C7 von Intel und EP4CGX75CF23I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX75DF27C7 | EP4CGX75CF23I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $86,80 | $135,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone IV GX | Cyclone IV GX |
| Logic Cells | 73,920 | — |
| Configurable Logic Blocks | 4,620 | — |
| User I/O | 310 | — |
| Configuration-related Bits | 4,257,792 | — |
| Versorgungsspannung | 1.2 V | — |
| Gehäuse | 672-ball FBGA | — |
| Package Body | 27 mm x 27 mm | — |
| Ball Pitch | 1 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40C to +100C (Industrial I7 grade) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Logic Elements | — | 73,920 |
| Total Memory Bits | — | 4,257,792 |
| Number of LABs/CLBs | — | 4,620 |
| Number of Logic Elements/Cells | — | 73,920 |
| Total RAM Bits | — | 4,257,792 |
| Number of I/O | — | 290 |
| Number of Multipliers (18x18) | — | 290 |
| Voltage Supply | — | 1.0 V / 1.2 V / 2.5 V / 3.3 V |
| Core Voltage | — | 1.2 V |
| Gehäuse / Bauform | — | 484-FBGA (FBGA-484, 23x23 mm, 1.0 mm pitch) |
| Process Technology | — | 60 nm |
| Transceiver Speed | — | 3.125 Gbps |
| Lead-Free | — | Yes |
| MSL-Level | — | [DATA_NEEDED: MSL Level] |