EP4CGX75DF27C7 vs EP4CGX75CF23I7 Comparación
Comparación detallada lado a lado de EP4CGX75DF27C7 por Intel y EP4CGX75CF23I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX75DF27C7 | EP4CGX75CF23I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $86,80 | $135,00 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone IV GX | Cyclone IV GX |
| Logic Cells | 73,920 | — |
| Configurable Logic Blocks | 4,620 | — |
| User I/O | 310 | — |
| Configuration-related Bits | 4,257,792 | — |
| Tensión de alimentación | 1.2 V | — |
| Encapsulado | 672-ball FBGA | — |
| Package Body | 27 mm x 27 mm | — |
| Ball Pitch | 1 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40C to +100C (Industrial I7 grade) |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Logic Elements | — | 73,920 |
| Total Memory Bits | — | 4,257,792 |
| Number of LABs/CLBs | — | 4,620 |
| Number of Logic Elements/Cells | — | 73,920 |
| Total RAM Bits | — | 4,257,792 |
| Number of I/O | — | 290 |
| Number of Multipliers (18x18) | — | 290 |
| Voltage Supply | — | 1.0 V / 1.2 V / 2.5 V / 3.3 V |
| Core Voltage | — | 1.2 V |
| Encapsulado / Carcasa | — | 484-FBGA (FBGA-484, 23x23 mm, 1.0 mm pitch) |
| Process Technology | — | 60 nm |
| Transceiver Speed | — | 3.125 Gbps |
| Lead-Free | — | Yes |
| Nivel MSL | — | [DATA_NEEDED: MSL Level] |