EP4CGX75DF27C8N vs EP4CGX75DF27I6N Vergleich

Detaillierter Direktvergleich von EP4CGX75DF27C8N von Intel und EP4CGX75DF27I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4CGX75DF27C8N EP4CGX75DF27I6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $117,11 $65,00
Device Family Cyclone IV GX —
Logic Elements (LE) 73,920 73,920
Logic Array Blocks (LAB) 4,605 —
Embedded Memory 4,257,792 bits (approx. 532 Kbits RAM) —
Embedded 18x18 Multipliers 274 —
User I/O Pins 310 —
High-Speed Transceivers Up to 8 channels, 3.125 Gbps —
PLLs 4 [DATA_NEEDED: total PLL count]
Global Clock Networks 20 —
Core Voltage 1.2 V —
Process Technology 60 nm low-power CMOS —
Gehäuse 672-ball FBGA (F27) FBGA-672 (FineLine BGA)
Operating Temperature (Commercial) 0C to +85C —
Montageart Surface Mount —
Configuration Method SRAM-based, requires external config device —
PCIe Hard IP PCIe Gen1 x1/x2/x4 endpoint —
RoHS-Status Compliant Compliant
Lead-Free / Halogen-Free Yes / [DATA_NEEDED: halogen free status] —
Family — Cyclone IV GX
Device Model — EP4CGX75
Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count]
Embedded Memory Bits — 4,257,792
Embedded Memory Blocks — M9K (9 Kbit)
Maximum User I/O — 310
Transceivers — Up to 8 channels
Transceiver Data Rate — Up to 3.125 Gbps
Hard PCIe Blocks — x1 / x2 Gen1
Process Node — 60 nm
Core Voltage (VCCINT) — 1.2 V
Pin / Ball Count — 672
Operating Temperature (I6N suffix) — -40C to +100C (industrial)
Configuration Modes — JTAG, Serial, Parallel
Lead-Free — Yes

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