EP4CGX75DF27C8N vs EP4CGX75DF27I6N Comparação

Comparação detalhada lado a lado de EP4CGX75DF27C8N por Intel e EP4CGX75DF27I6N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Comparação de especificações

Parâmetro EP4CGX75DF27C8N EP4CGX75DF27I6N
Marca Intel Intel
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $117,11 $65,00
Device Family Cyclone IV GX —
Logic Elements (LE) 73,920 73,920
Logic Array Blocks (LAB) 4,605 —
Embedded Memory 4,257,792 bits (approx. 532 Kbits RAM) —
Embedded 18x18 Multipliers 274 —
User I/O Pins 310 —
High-Speed Transceivers Up to 8 channels, 3.125 Gbps —
PLLs 4 [DATA_NEEDED: total PLL count]
Global Clock Networks 20 —
Core Voltage 1.2 V —
Process Technology 60 nm low-power CMOS —
Encapsulamento 672-ball FBGA (F27) FBGA-672 (FineLine BGA)
Operating Temperature (Commercial) 0C to +85C —
Tipo de montagem Surface Mount —
Configuration Method SRAM-based, requires external config device —
PCIe Hard IP PCIe Gen1 x1/x2/x4 endpoint —
Status RoHS Compliant Compliant
Lead-Free / Halogen-Free Yes / [DATA_NEEDED: halogen free status] —
Family — Cyclone IV GX
Device Model — EP4CGX75
Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count]
Embedded Memory Bits — 4,257,792
Embedded Memory Blocks — M9K (9 Kbit)
Maximum User I/O — 310
Transceivers — Up to 8 channels
Transceiver Data Rate — Up to 3.125 Gbps
Hard PCIe Blocks — x1 / x2 Gen1
Process Node — 60 nm
Core Voltage (VCCINT) — 1.2 V
Pin / Ball Count — 672
Operating Temperature (I6N suffix) — -40C to +100C (industrial)
Configuration Modes — JTAG, Serial, Parallel
Lead-Free — Yes

Fichas técnicas e recursos

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