EP4S40G2F40I2NAB vs EP4SGX230TF35C4N Vergleich
Detaillierter Direktvergleich von EP4S40G2F40I2NAB von Intel und EP4SGX230TF35C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4S40G2F40I2NAB | EP4SGX230TF35C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.120,00 | $2.895,00 |
| Family | Stratix IV GT | Stratix IV GX |
| Logic Elements (LE) | 228,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total Embedded Memory Bits | 17,544,192 | — |
| Embedded Memory Type | M9K + M144K blocks | — |
| User I/O Pins | 654 | — |
| Multi-Gigigabit Transceivers | 48 (Stratix IV GT, configuration-dependent) | — |
| Transceiver Data Rate | 600 Mbps to 11.3 Gbps | — |
| PLLs | 8 | 24 |
| Hard IP for PCIe | Gen1 / Gen2 endpoints | — |
| Core Voltage | 0.95 V | — |
| Process Technology | 40 nm | 40 nm |
| Gehäuse | 1517-ball FCBGA (F40) | 1152-ball FBGA (FineLine BGA), 35x35 mm |
| Betriebstemperatur | -40C to +100C (industrial, I2) | 0C to +85C (commercial) |
| MSL-Level | 4 (72 hours floor life) | — |
| Montageart | Surface Mount (flip-chip BGA) | — |
| Logic Elements | — | 228,000 |
| Embedded Memory (M9K blocks) | — | 1,288 blocks / 17,544 Kbits |
| MLAB Memory | — | 17.7 Mbits |
| DSP Blocks (18x18 Multipliers) | — | 1,288 (up to 256 GMACs) |
| Maximum User I/O Pins | — | 564 |
| Transceivers | — | Embedded multi-gigabit transceivers up to 8.5 Gbps |
| Global Clock Networks | — | 16 |
| Speed Grade | — | C4 (commercial) |
| Configuration | — | Active/passive serial, fast passive parallel |
| Supply Voltage Core | — | 0.9 V (nominal) |
| Design Software | — | Quartus II (service pack recommended) |