EP4S40G2F40I2NAB vs EP4SGX230TF35C4N Comparación
Comparación detallada lado a lado de EP4S40G2F40I2NAB por Intel y EP4SGX230TF35C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4S40G2F40I2NAB | EP4SGX230TF35C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.120,00 | $2.895,00 |
| Family | Stratix IV GT | Stratix IV GX |
| Logic Elements (LE) | 228,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total Embedded Memory Bits | 17,544,192 | — |
| Embedded Memory Type | M9K + M144K blocks | — |
| User I/O Pins | 654 | — |
| Multi-Gigigabit Transceivers | 48 (Stratix IV GT, configuration-dependent) | — |
| Transceiver Data Rate | 600 Mbps to 11.3 Gbps | — |
| PLLs | 8 | 24 |
| Hard IP for PCIe | Gen1 / Gen2 endpoints | — |
| Core Voltage | 0.95 V | — |
| Process Technology | 40 nm | 40 nm |
| Encapsulado | 1517-ball FCBGA (F40) | 1152-ball FBGA (FineLine BGA), 35x35 mm |
| Temperatura de funcionamiento | -40C to +100C (industrial, I2) | 0C to +85C (commercial) |
| Nivel MSL | 4 (72 hours floor life) | — |
| Tipo de montaje | Surface Mount (flip-chip BGA) | — |
| Logic Elements | — | 228,000 |
| Embedded Memory (M9K blocks) | — | 1,288 blocks / 17,544 Kbits |
| MLAB Memory | — | 17.7 Mbits |
| DSP Blocks (18x18 Multipliers) | — | 1,288 (up to 256 GMACs) |
| Maximum User I/O Pins | — | 564 |
| Transceivers | — | Embedded multi-gigabit transceivers up to 8.5 Gbps |
| Global Clock Networks | — | 16 |
| Speed Grade | — | C4 (commercial) |
| Configuration | — | Active/passive serial, fast passive parallel |
| Supply Voltage Core | — | 0.9 V (nominal) |
| Design Software | — | Quartus II (service pack recommended) |