EP4SGX110HF35I3G vs EP4SGX70HF35I3G Vergleich
Detaillierter Direktvergleich von EP4SGX110HF35I3G von Intel und EP4SGX70HF35I3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX110HF35I3G | EP4SGX70HF35I3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.900,00 | $1.250,00 |
| Logic Elements | 105,600 | 72,600 LE |
| Embedded Memory Bits | 9,793,536 (9.4 Mbit) | — |
| Maximum User I/O Pins | 488 | — |
| Multipliers (18x18) | 352 | — |
| Core Supply Voltage (nominal) | 0.9 V | — |
| Gehäuse | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch |
| Family | Stratix IV GX | — |
| Speed/Grade | I3 (Industrial, -3 speed) | — |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C | — |
| Multi-Gigabit Transceivers | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) | — |
| Hard IP Blocks | PCIe Gen1/Gen2, external memory PHY | — |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount (Flip-Chip BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant | — |
| Lead-Free / Halogen-Free | Lead-free | — |
| Process Technology | 40 nm low-power CMOS | 40 nm TSMC |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Series | — | Stratix IV GX |
| Adaptive Logic Modules (ALMs) | — | 29,040 ALM |
| Embedded Memory | — | 7.20 Mbit (7,564,880 bits) |
| User I/Os | — | 480 |
| Transceivers | — | 9 channels up to 8.5 Gbps (GX) |
| 18x18 Multipliers | — | 488 |
| PLLs | — | 4 per quadrant |
| Core Supply Voltage | — | 950 mV |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Speed Grade | — | I3 |
| Packaging | — | Tray |