EP4SGX110HF35I3G vs EP4SGX70HF35I3G Comparación
Comparación detallada lado a lado de EP4SGX110HF35I3G por Intel y EP4SGX70HF35I3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX110HF35I3G | EP4SGX70HF35I3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.900,00 | $1.250,00 |
| Logic Elements | 105,600 | 72,600 LE |
| Embedded Memory Bits | 9,793,536 (9.4 Mbit) | — |
| Maximum User I/O Pins | 488 | — |
| Multipliers (18x18) | 352 | — |
| Core Supply Voltage (nominal) | 0.9 V | — |
| Encapsulado | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch | 1152-ball FCBGA, 35x35 mm, 1.0 mm pitch |
| Family | Stratix IV GX | — |
| Speed/Grade | I3 (Industrial, -3 speed) | — |
| Temperatura de unión de funcionamiento | -40 C to +100 C | — |
| Multi-Gigabit Transceivers | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) | — |
| Hard IP Blocks | PCIe Gen1/Gen2, external memory PHY | — |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount (Flip-Chip BGA) |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant | — |
| Lead-Free / Halogen-Free | Lead-free | — |
| Process Technology | 40 nm low-power CMOS | 40 nm TSMC |
| Configuration Memory | SRAM-based (volatile, requires configuration device) | — |
| Series | — | Stratix IV GX |
| Adaptive Logic Modules (ALMs) | — | 29,040 ALM |
| Embedded Memory | — | 7.20 Mbit (7,564,880 bits) |
| User I/Os | — | 480 |
| Transceivers | — | 9 channels up to 8.5 Gbps (GX) |
| 18x18 Multipliers | — | 488 |
| PLLs | — | 4 per quadrant |
| Core Supply Voltage | — | 950 mV |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Speed Grade | — | I3 |
| Packaging | — | Tray |