EP4SGX230DF29I3N vs EP4SGX70DF29C2XG Vergleich
Detaillierter Direktvergleich von EP4SGX230DF29I3N von Intel und EP4SGX70DF29C2XG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX230DF29I3N | EP4SGX70DF29C2XG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.480,00 | $1.295,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Series | EP4SGX230 | — |
| Logic Elements | 228000 | — |
| Number of LABs/CLBs | 9120 | — |
| Number of Logic Elements/Cells | 228000 | — |
| Total RAM Bits | 17544192 | — |
| Number of I/O | 372 | — |
| Voltage - Supply | 0.87 V to 0.93 V | — |
| Betriebstemperatur | -40C to +100C (TJ) | — |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse / Bauform | 780-BBGA, FCBGA | — |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Programmable | Not Verified (per distributor listing) | — |
| Part Status | Obsolete | — |
| RoHS-Status | Compliant (per distributor listing) | Compliant |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory | — | 7,564,880 bits |
| Maximum User I/O | — | 372 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Gehäuse | — | 780-FBGA (29x29 mm) |
| Transceiver Speed | — | Up to 8.5 Gbps |
| Transceiver Count | — | [DATA_NEEDED: number of transceiver channels] |
| DSP Blocks (18x18 Multipliers) | — | 364 |
| Betriebstemperaturbereich | — | -40C to +85C (commercial) |
| MSL-Level | — | 3 (168 hours) |
| Lead-Free | — | Yes |
| Tray Packaging | — | Yes |