EP4SGX230DF29I3N vs EP4SGX70DF29C2XG Comparación
Comparación detallada lado a lado de EP4SGX230DF29I3N por Intel y EP4SGX70DF29C2XG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX230DF29I3N | EP4SGX70DF29C2XG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.480,00 | $1.295,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Series | EP4SGX230 | — |
| Logic Elements | 228000 | — |
| Number of LABs/CLBs | 9120 | — |
| Number of Logic Elements/Cells | 228000 | — |
| Total RAM Bits | 17544192 | — |
| Number of I/O | 372 | — |
| Voltage - Supply | 0.87 V to 0.93 V | — |
| Temperatura de funcionamiento | -40C to +100C (TJ) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Encapsulado / Carcasa | 780-BBGA, FCBGA | — |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Programmable | Not Verified (per distributor listing) | — |
| Part Status | Obsolete | — |
| Estado RoHS | Compliant (per distributor listing) | Compliant |
| Logic Elements (LE) | — | 72,600 |
| Embedded Memory | — | 7,564,880 bits |
| Maximum User I/O | — | 372 |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Encapsulado | — | 780-FBGA (29x29 mm) |
| Transceiver Speed | — | Up to 8.5 Gbps |
| Transceiver Count | — | [DATA_NEEDED: number of transceiver channels] |
| DSP Blocks (18x18 Multipliers) | — | 364 |
| Rango de temperatura de funcionamiento | — | -40C to +85C (commercial) |
| Nivel MSL | — | 3 (168 hours) |
| Lead-Free | — | Yes |
| Tray Packaging | — | Yes |