EP4SGX230HF35I4G vs EP4SGX230TF35C4N Vergleich
Detaillierter Direktvergleich von EP4SGX230HF35I4G von Intel und EP4SGX230TF35C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX230HF35I4G | EP4SGX230TF35C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.900,00 | $2.895,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 228,000 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Gehäuse | 1152-ball FCBGA (HF35) | 1152-ball FBGA (FineLine BGA), 35x35 mm |
| Betriebstemperatur | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Core Voltage | 0.93 V | — |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | 24 |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| RoHS-Status | Compliant | — |
| Montageart | Surface Mount (Flip-Chip BGA) | — |
| Embedded Memory (M9K blocks) | — | 1,288 blocks / 17,544 Kbits |
| MLAB Memory | — | 17.7 Mbits |
| DSP Blocks (18x18 Multipliers) | — | 1,288 (up to 256 GMACs) |
| Maximum User I/O Pins | — | 564 |
| Transceivers | — | Embedded multi-gigabit transceivers up to 8.5 Gbps |
| Global Clock Networks | — | 16 |
| Process Technology | — | 40 nm |
| Speed Grade | — | C4 (commercial) |
| Configuration | — | Active/passive serial, fast passive parallel |
| Supply Voltage Core | — | 0.9 V (nominal) |
| Design Software | — | Quartus II (service pack recommended) |