EP4SGX230HF35I4G vs EP4SGX230TF35C4N Comparación
Comparación detallada lado a lado de EP4SGX230HF35I4G por Intel y EP4SGX230TF35C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX230HF35I4G | EP4SGX230TF35C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.900,00 | $2.895,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 228,000 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Encapsulado | 1152-ball FCBGA (HF35) | 1152-ball FBGA (FineLine BGA), 35x35 mm |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to +85C (commercial) |
| Core Voltage | 0.93 V | — |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | 24 |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| Estado RoHS | Compliant | — |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | — |
| Embedded Memory (M9K blocks) | — | 1,288 blocks / 17,544 Kbits |
| MLAB Memory | — | 17.7 Mbits |
| DSP Blocks (18x18 Multipliers) | — | 1,288 (up to 256 GMACs) |
| Maximum User I/O Pins | — | 564 |
| Transceivers | — | Embedded multi-gigabit transceivers up to 8.5 Gbps |
| Global Clock Networks | — | 16 |
| Process Technology | — | 40 nm |
| Speed Grade | — | C4 (commercial) |
| Configuration | — | Active/passive serial, fast passive parallel |
| Supply Voltage Core | — | 0.9 V (nominal) |
| Design Software | — | Quartus II (service pack recommended) |