EP4SGX230HF35I4G vs EP4SGX70HF35C3G Vergleich
Detaillierter Direktvergleich von EP4SGX230HF35I4G von Intel und EP4SGX70HF35C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX230HF35I4G | EP4SGX70HF35C3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.900,00 | $1.380,00 |
| Family | Stratix IV GX | — |
| Logic Elements | 228,000 | 72,600 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Gehäuse | 1152-ball FCBGA (HF35) | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Core Voltage | 0.93 V | — |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Series | — | Stratix IV GX |
| LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.87 V to 0.93 V |
| Operating Temperature (Junction) | — | 0°C to 85°C |
| Temperature Grade | — | Commercial (C3) |
| Speed Grade | — | HF35 |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |