EP4SGX230HF35I4G vs EP4SGX70HF35C3G Comparación
Comparación detallada lado a lado de EP4SGX230HF35I4G por Intel y EP4SGX70HF35C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX230HF35I4G | EP4SGX70HF35C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.900,00 | $1.380,00 |
| Family | Stratix IV GX | — |
| Logic Elements | 228,000 | 72,600 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Encapsulado | 1152-ball FCBGA (HF35) | 1152-BBGA, FCBGA (35 mm × 35 mm) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Core Voltage | 0.93 V | — |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Series | — | Stratix IV GX |
| LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| User I/O Count | — | 488 |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.87 V to 0.93 V |
| Operating Temperature (Junction) | — | 0°C to 85°C |
| Temperature Grade | — | Commercial (C3) |
| Speed Grade | — | HF35 |
| Configuration Method | — | Passive Serial, Fast Passive Parallel, Active Serial, JTAG |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |