EP4SGX290NF45I4N vs EP4SGX360NF45C4N Vergleich
Detaillierter Direktvergleich von EP4SGX290NF45I4N von Intel und EP4SGX360NF45C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX290NF45I4N | EP4SGX360NF45C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.095,00 | $3.490,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 291,200 | 353,600 |
| LABs/CLBs | 11,648 | — |
| Total RAM Bits | 17,661,952 | — |
| User I/O Count | 920 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage | 0.87 V to 0.93 V | — |
| Process Technology | 40 nm | 40 nm TSMC |
| Transceivers | 8.5 Gbps multi-gigabit (GX) | — |
| Gehäuse | 1932-BBGA, FCBGA (NF45) | 1932-ball FCBGA (NF45) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebs-Sperrschichttemperatur | -40C to +100C (industrial) | — |
| RoHS-Status | Compliant | — |
| JESD-609 Code | e1 | — |
| Package Body Material | Plastic / Epoxy | — |
| Terminal Form | Ball | — |
| Package Code | BGA | F1932 / NF45 |
| Device | — | EP4SGX360 |
| Adaptive Logic Modules (ALMs) | — | 14,144 LABs / 141,440 ALMs |
| Embedded Memory (bits) | — | 23,105,536 |
| Maximum User I/Os | — | 920 |
| Core Voltage (VCC) | — | 0.9 V |
| Speed Grade | — | C4 (fastest) |
| Temperature Grade | — | Commercial (0 C to 85 C) |
| Lead-Free / RoHS | — | Compliant (lead-free) |
| MSL-Level | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |
| Embedded Transceivers | — | [DATA_NEEDED: number of transceiver channels for NF45 package] |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: 18x18 multiplier count] |
| PLL Count | — | [DATA_NEEDED: PLL count for this device/package] |