EP4SGX290NF45I4N - 290K LE Stratix IV GX FPGA | Intel
Teilenummer: EP4SGX290NF45I4N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2700 | $27.000,00 |
| 100 | $2495 | $249.500,00 |
| 500 | $2295 | $1.147.500,00 |
| 1.000 | $2095 | $2.095.000,00 |
EP4SGX290NF45I4N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing via a configuration bitstream. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and sit alongside CPLDs in the digital logic family, occupying the high-density end of the spectrum. The Stratix IV family in particular targets high-throughput signal processing, wireline backplanes, and ASIC prototyping with embedded transcevers, hard memory blocks, and DSP blocks.
Key features of the EP4SGX290NF45I4N include integrated 8.5 Gbps transceivers (GX variant), up to 17.7 Mbits of embedded RAM, hard-coded DSP blocks for fixed- and floating-point math, and dynamic on-chip termination for memory interfaces. The 1932-ball FCBGA package exposes 920 general-purpose I/O lanes - among the highest pin counts in the Stratix IV family - enabling parallel high-speed interfaces such as DDR3 with read/write leveling.
Architecturally, the device pairs a low-leakage 40 nm core fabric with 8.5 Gbps multi-gigabit transceivers and hardened PCIe Gen1/Gen2 IP blocks. The 11,648 LABs form the basis of combinational and sequential logic, while MLAB blocks and M9K/M144K memory blocks provide distributed and block RAM for buffers, FIFOs, and lookup tables used in signal processing pipelines.
Typical applications include high-end ASIC prototyping, radar and digital signal processing front-ends, wireline backplane aggregation, broadcast video processing, and PCIe Gen2 host cards. The GX transceivers make it suitable for 40G/100G line-card prototyping and OTN/SONET framer designs.
When laying out this device, allocate a minimum of 12 power rails including VCC, VCCP, VCCPT, VCCPGM, VCCA_PLL, VCCD_PLL, and transceiver supplies (VCCA_GXB, VCCH_GXB); each PLL/GXB block requires dedicated ferrite-bead-isolated filtering. Use 100 nF X7R 0402/0201 bypass capacitors within 1 mm of every BGA pin and a minimum 8-layer PCB stack-up to maintain signal integrity on 920 simultaneous switching outputs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für EP4SGX290NF45I4N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4SGX290NF45I4N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Speed Grade, Logic Elements, Adaptive Logic Modules (ALMs).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4SGX290NF45I4
✅ Drop-In✓ Auf Lager
$9875 / Stück
Datenblatt ansehen →EP4SGX290NF45I3N
✅ Drop-In✓ Auf Lager
$9200 / Stück
Datenblatt ansehen →EP4SGX290NF45C4N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP4SGX290NF45C2N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP4SGX230KF40I4N
✅ Drop-In✓ Auf Lager
$3725 / Stück
Datenblatt ansehen →EP4SE820F43C3G
✅ Drop-In✓ Auf Lager
$17316.76 / Stück
Datenblatt ansehen →EP4SGX290NF45I4N Grenzwerte & elektrische Eigenschaften
| Family | Stratix IV GX |
| Logic Elements | 291,200 |
| LABs/CLBs | 11,648 |
| Total RAM Bits | 17,661,952 |
| User I/O Count | 920 |
| Core Voltage | 0.87 V to 0.93 V |
| Process Technology | 40 nm |
| Transceivers | 8.5 Gbps multi-gigabit (GX) |
| Gehäuse | 1932-BBGA, FCBGA (NF45) |
| Montageart | Surface Mount |
| Betriebs-Sperrschichttemperatur | -40C to +100C (industrial) |
| RoHS-Status | Compliant |
| JESD-609 Code | e1 |
| Package Body Material | Plastic / Epoxy |
| Terminal Form | Ball |
| Package Code | BGA |
EP4SGX290NF45I4N bga Pinbelegungsleitfaden
Pinbelegung für EP4SGX290NF45I4N (bga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4SGX290NF45I4N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4SGX290NF45I4N ist geeignet für 6 Anwendungs: High-Speed Wireline Backplane Aggregation, ASIC Prototyping and Emulation, Radar and DSP Signal Processing Front-End, PCIe Gen2 Host and Endpoint Cards, Broadcast Video Processing and Frame Buffers, Industrial Test and Measurement Instrumentation.
High-Speed Wireline Backplane Aggregation
The EP4SGX290NF45I4N is well-suited to 10G/40G wireline line cards because its integrated 8.5 Gbps multi-gigabit transceivers deliver roughly 24 SERDES channels that can be aggregated into 40G KR4 or OTU2 ports. The 920 user I/O and 17.7 Mbits of embedded RAM allow deep packet-buffer FIFO architectures without external SRAM. Placed on a backplane aggregation card, it pairs with external QSFP+ optics; the FCBGA NF45 package supports the high-speed escape routing required for multi-gigabit serial channels. Trade-off: power consumption of the GX transceivers (each running ~600 mW at 8.5 Gbps) increases card thermal budget.
Empfohlen
ASIC Prototyping and Emulation
The 291,200 logic elements and 17.7 Mbits embedded RAM position the EP4SGX290NF45I4N as an ASIC prototyping vehicle for mid-density ASICs. Engineers can map a 30 Mgate-equivalent design across the SGX290's logic fabric plus its embedded M144K memory blocks for realistic timing-closure studies. Industrial -40C to 100C junction operation permits bench characterization at both temperature extremes. The FCBGA NF45 footprint allows multiple FPGAs to be co-located on a partitioning board for multi-FPGA ASIC prototyping flows.
Empfohlen
Radar and DSP Signal Processing Front-End
With 8.5 Gbps transceivers and hard DSP blocks, the EP4SGX290NF45I4N fits radar front-end preprocessing such as pulse compression, FFT, and beamforming. The device implements 18x18 multipliers and 36-bit accumulators in dedicated logic that sustain multi-Gsample/s FIR filter rates, while the 920 I/O permit parallel LVDS ADC/DAC interfaces. The industrial temperature grade is critical for defense and avionics thermal envelopes. Compared with newer Agilex devices, this part consumes more power per GMAC but offers proven tool flow for legacy designs.
Empfohlen
PCIe Gen2 Host and Endpoint Cards
The EP4SGX290NF45I4N includes hard PCIe Gen1/Gen2 IP blocks at up to x8 lanes, enabling PCIe host-card prototyping without soft IP. Combined with 920 user I/O it can expose up to four PCIe endpoints and several hundred general-purpose I/O for mezzanine-card designs. The 1932-ball NF45 FCBGA supports the high-density escape routing required for x8 PCIe Gen2. Designers should configure reference clock from a low-jitter 100 MHz oscillator to meet PCIe Gen2 jitter budget.
Empfohlen
Broadcast Video Processing and Frame Buffers
The 17.7 Mbits of embedded RAM plus M144K memory blocks are sufficient to implement multi-line video frame buffers and color-space converters for 3G-SDI/HD-SDI broadcast equipment. The 920 user I/O and 8.5 Gbps transceivers support SDI input/output along with HDMI conversion paths. Industrial temperature grade permits continuous operation in studio and head-end environments. Compared with smaller Cyclone devices, the EP4SGX290NF45I4N delivers 3x the logic capacity, allowing multi-channel 4K pipeline designs in a single FPGA.
Empfohlen
Industrial Test and Measurement Instrumentation
The EP4SGX290NF45I4N is a strong fit for high-channel-count protocol analyzers, logic analyzers, and ATE equipment because of its 920 user I/O and high-speed transceivers. Designers can probe multiple buses simultaneously while running real-time pattern matching in on-chip RAM. Industrial -40C to +100C operation suits bench and field-test environments. Pin-compatible drop-in alternatives like EP4SGX290NF45I4 enable rapid substitution when lead times diverge; the FCBGA NF45 footprint maintains signal integrity for high-density probing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4SGX290NF45I4N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4SGX290NF45I4 | EP4SGX290NF45I3N | EP4SGX290NF45C4N | EP4SGX290NF45C2N | EP4SGX230KF40I4N | EP4SE820F43C3G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 291,200 | 291,200 (same) | 291,200 (same) | 291,200 (same) | 291,200 (same) | 230,000 (-21%) | 820,000 (+182%) |
| Core Voltage | 0.87 V to 0.93 V | 0.87 V to 0.93 V (same) | 0.87 V to 0.93 V (same) | 0.87 V to 0.93 V (same) | 0.87 V to 0.93 V (same) | 0.87 V to 0.93 V (same) | 0.85 V to 0.93 V |
| Transceivers | 8.5 Gbps GX | 8.5 Gbps GX (same) | 8.5 Gbps GX (same) | 8.5 Gbps GX (same) | 8.5 Gbps GX (same) | 8.5 Gbps GX (same) | None (Stratix IV E) |
| Operating Junction Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to 85C (commercial) | 0C to 85C (commercial) | -40C to +100C (industrial) | 0C to 85C (commercial) |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade as primary offering (vs. EP4SGX290NF45C4N)
- Highest 920 user-I/O in Stratix IV GX family at this logic tier (vs. EP4SGX290KF43C2N)
- Integrated 8.5 Gbps multi-gigabit transceivers (vs. EP4SE820F43C3G)
Designhinweise
Estimated: at typical configuration (30% logic utilization, 8 Gbps SERDES active, 25C ambient), the EP4SGX290NF45I4N draws approximately 8-12 W from the core supply alone, plus 0.6 W per active 8.5 Gbps transceiver. Designers must provision a 12-rail power tree including VCC (0.9 V), VCCP, VCCPT (1.5 V or 1.8 V), VCCPGM, VCCA_PLL/VCCD_PLL, and VCCA_GXB/VCCH_GXB (typically 1.0 V and 1.5 V). Each rail should have its own ferrite-bead-isolated filter and be sequenced per Intel's Power-Up sequencing requirements; transceivers should be held in reset until all GXB supplies are stable. Use the Intel PowerPlay Early Power Estimator before layout.
The 1932-ball NF45 FCBGA package has a ball pitch of approximately 1.0 mm, requiring a minimum 8-layer PCB stack-up with stacked microvias or laser-drilled vias for BGA escape routing. Decoupling capacitors should be placed within 1 mm of every BGA ball - typically 100 nF X7R 0402 size - with high-frequency bypass using 10 nF and 1 nF values. A continuous reference plane beneath the FPGA is essential; split planes must avoid crossing the high-speed GXB and DDR3 regions. The Intel flip-chip BGA escape routing guidelines should be referenced before layout finalization.
Estimated: with a 12 W total power dissipation and a typical FCBGA theta_JA of 10-15 C/W (depending on PCB stack-up and airflow), the junction temperature rise above ambient is approximately 30-50 C at no airflow. Above 5 W or in enclosed chassis, forced-air cooling (200 LFM minimum) is recommended to keep Tj below 100 C. Use the Stratix IV FPGA junction temperature estimator; place thermal vias under the FCBGA thermal pad to provide a low-impedance path to internal copper planes. For industrial -40C to +100C operation, do not exceed 100 C at worst-case load.
Multi-gigabit transceivers running at 8.5 Gbps require 100-ohm controlled differential routing with 5-mil trace width and 7-mil gap, length-matched within 0.5 mm. The reference plane must be continuous; never route over a plane split. Use the Quartus II IBIS-AMI models for system-level channel simulation; the Stratix IV GX Transceiver User Guide provides eye-diagram templates for chip-to-chip, chip-to-module, and backplane applications. AC-coupling capacitors (typically 100 nF) must be placed on each transmit pair, with the capacitor closest to the FPGA receiver preferred.
Compliance-Informationen
RoHS and Pb-free compliant per JESD-609 e1 terminal code (matte tin terminal finish). Not AEC-Q100 qualified - this is a high-performance industrial FPGA rather than automotive-grade. Industrial temperature grade supports -40C to +100C junction operation.
