EP4SGX360FF35C2XN vs EP4SGX360FF35C2X Vergleich
Detaillierter Direktvergleich von EP4SGX360FF35C2XN von Intel und EP4SGX360FF35C2X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FF35C2XN | EP4SGX360FF35C2X |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.600,00 | $3.450,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | C2 (fastest) |
| Number of Transceivers | 24 | 24 |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | — |
| Gehäuse | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-ball FCBGA (FF35), 35 x 35 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Adaptive Logic Modules (LABs) | — | 14,144 |
| Embedded Memory | — | 23,105,536 bits |
| User I/O Pins | — | 564 |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| DSP Blocks (18x18 multipliers) | — | 1,288 |
| Global Clock Networks | — | 32 |
| Process Node | — | 40 nm CMOS |
| Betriebs-Sperrschichttemperatur | — | 0 °C to +85 °C (commercial) |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II |