EP4SGX360FF35I3 vs EP4SGX360FF35C3N Vergleich
Detaillierter Direktvergleich von EP4SGX360FF35I3 von Intel und EP4SGX360FF35C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FF35I3 | EP4SGX360FF35C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.695,00 | $7.610,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | — |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm |
| Betriebstemperatur | -40C to +100C | 0C to +85C (commercial) |
| Gehäuse | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (FF35, 35 mm) |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | I3 | C3 |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| MSL-Level | [DATA_NEEDED: MSL] | — |
| Number of Logic Elements | — | 353,600 |
| Number of LABs/CLBs | — | 14,144 |
| Number of User I/O | — | 564 |
| Core Voltage Supply | — | 0.87 V to 0.93 V |
| Supply Voltage Range | — | 0.87 V to 0.93 V (core) |
| Transceivers | — | Up to 24 channels at up to 8.5 Gbps |
| DSP Blocks | — | 48 (18x18 multipliers) |
| Lead-Free | — | Yes |