EP4SGX360FF35I3 vs EP4SGX360FF35C3N Comparaison
Comparaison détaillée côte à côte de EP4SGX360FF35I3 par Intel et EP4SGX360FF35C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4SGX360FF35I3 | EP4SGX360FF35C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 695,00 | $7 610,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | — |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm |
| Température de fonctionnement | -40C to +100C | 0C to +85C (commercial) |
| Boîtier | 1152-BBGA, FCBGA (Flip-Chip) | 1152-BBGA, FCBGA (FF35, 35 mm) |
| Type de montage | Surface Mount | Surface Mount |
| Speed Grade | I3 | C3 |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Niveau MSL | [DATA_NEEDED: MSL] | — |
| Number of Logic Elements | — | 353,600 |
| Number of LABs/CLBs | — | 14,144 |
| Number of User I/O | — | 564 |
| Core Voltage Supply | — | 0.87 V to 0.93 V |
| Supply Voltage Range | — | 0.87 V to 0.93 V (core) |
| Transceivers | — | Up to 24 channels at up to 8.5 Gbps |
| DSP Blocks | — | 48 (18x18 multipliers) |
| Lead-Free | — | Yes |