EP4SGX360FF35I3 vs EP4SGX360FF35I4 Vergleich

Detaillierter Direktvergleich von EP4SGX360FF35I3 von Intel und EP4SGX360FF35I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4SGX360FF35I3 EP4SGX360FF35I4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.695,00 $1.019,40
Series Stratix IV GX Stratix IV GX
Family Stratix IV GX —
Logic Elements (LE) 353,600 —
LABs/CLBs 14,144 —
Total RAM Bits 23,105,536 —
Embedded Memory [DATA_NEEDED: total Kbits] [DATA_NEEDED: embedded memory capacity]
User I/O Count 564 —
Number of I/O Banks [DATA_NEEDED: I/O bank count] —
Number of Transceivers [DATA_NEEDED: transceiver count] —
Transceiver Data Rate (max) [DATA_NEEDED: Gbps] —
Number of PLLs [DATA_NEEDED: PLL count] —
Core Voltage 0.9 V 0.9 V
Process Technology 40 nm 40 nm
Betriebstemperatur -40C to +100C —
Gehäuse 1152-BBGA, FCBGA (Flip-Chip) 1152-pin FC-FBGA
Montageart Surface Mount Surface Mount
Speed Grade I3 —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
MSL-Level [DATA_NEEDED: MSL] —
Device Type — Field Programmable Gate Array (FPGA)
Logic Cells — 353600
Logic Elements or Cells — 353600
Logic Array Blocks — 14144 LABs
I/O Count — 564 I/O
Package Type — BGA
Terminal Count — 1152
Package Shape — Square
Maximum Seated Height — 3.4 mm
Operating Temperature Grade — [DATA_NEEDED: operating temperature range]
Transceiver Count — [DATA_NEEDED: transceiver count]
Clock Frequency — [DATA_NEEDED: maximum clock frequency]
I/O Standards — [DATA_NEEDED: supported I/O standards]
Power Consumption — [DATA_NEEDED: power consumption]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
Lead-Free Status — [DATA_NEEDED: lead-free status]

Datenblätter & Ressourcen

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