EP4SGX360FF35I3 vs EP4SGX360FF35I4 对比
详细并排对比 EP4SGX360FF35I3 出自 Intel 和 EP4SGX360FF35I4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX360FF35I3 | EP4SGX360FF35I4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,695.00 | $1,019.40 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | — |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | — |
| Embedded Memory | [DATA_NEEDED: total Kbits] | [DATA_NEEDED: embedded memory capacity] |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| 工作温度 | -40C to +100C | — |
| 封装 | 1152-BBGA, FCBGA (Flip-Chip) | 1152-pin FC-FBGA |
| 安装类型 | Surface Mount | Surface Mount |
| Speed Grade | I3 | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| MSL 等级 | [DATA_NEEDED: MSL] | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 353600 |
| Logic Elements or Cells | — | 353600 |
| Logic Array Blocks | — | 14144 LABs |
| I/O Count | — | 564 I/O |
| Package Type | — | BGA |
| Terminal Count | — | 1152 |
| Package Shape | — | Square |
| Maximum Seated Height | — | 3.4 mm |
| Operating Temperature Grade | — | [DATA_NEEDED: operating temperature range] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Clock Frequency | — | [DATA_NEEDED: maximum clock frequency] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Power Consumption | — | [DATA_NEEDED: power consumption] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |