EP4SGX360FH29C4 vs EP4SGX360FF35C4N Vergleich
Detaillierter Direktvergleich von EP4SGX360FH29C4 von Intel und EP4SGX360FF35C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FH29C4 | EP4SGX360FF35C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.225,00 | $3.550,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 | 141,440 (Mouser reports 14,144 LABs) |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/Os | 289 | — |
| Transceivers | [DATA_NEEDED: number of transceivers and max data rate] | [DATA_NEEDED: transceiver count and data rate] |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| Betriebstemperatur | 0 C to +85 C (commercial, C4 grade) | — |
| Gehäuse | 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm | 1152-ball FC-BGA (FF35) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free and halogen-free status] | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Configuration Method | JTAG / Fast Passive Parallel / Active Serial | — |
| Memory Bits | — | 23,105,536 bits (~22 Mbit) |
| Maximum User I/Os | — | 564 |
| Number of LABs/CLBs | — | 14144 |
| Process Technology | — | 40 nm |
| Operating Temperature Grade | — | Commercial (C4) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Part Status | — | Obsolete (per Micropcba / distributor listings) |