EP4SGX360FH29C4 vs EP4SGX360FF35C4N Comparaison
Comparaison détaillée côte à côte de EP4SGX360FH29C4 par Intel et EP4SGX360FF35C4N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4SGX360FH29C4 | EP4SGX360FF35C4N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3 225,00 | $3 550,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 | 141,440 (Mouser reports 14,144 LABs) |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/Os | 289 | — |
| Transceivers | [DATA_NEEDED: number of transceivers and max data rate] | [DATA_NEEDED: transceiver count and data rate] |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| Température de fonctionnement | 0 C to +85 C (commercial, C4 grade) | — |
| Boîtier | 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm | 1152-ball FC-BGA (FF35) |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free and halogen-free status] | — |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Configuration Method | JTAG / Fast Passive Parallel / Active Serial | — |
| Memory Bits | — | 23,105,536 bits (~22 Mbit) |
| Maximum User I/Os | — | 564 |
| Number of LABs/CLBs | — | 14144 |
| Process Technology | — | 40 nm |
| Operating Temperature Grade | — | Commercial (C4) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Part Status | — | Obsolete (per Micropcba / distributor listings) |