EP4SGX360FH29C4 vs EP4SGX360FH29C3N Vergleich
Detaillierter Direktvergleich von EP4SGX360FH29C4 von Intel und EP4SGX360FH29C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FH29C4 | EP4SGX360FH29C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.225,00 | $1.495,00 |
| Series | Stratix IV GX | — |
| Family | Stratix IV | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | 141,440 | — |
| Logic Array Blocks (LABs) | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| User I/Os | 289 | 289 |
| Transceivers | [DATA_NEEDED: number of transceivers and max data rate] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Node | 40 nm | — |
| Betriebstemperatur | 0 C to +85 C (commercial, C4 grade) | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm | 780-FBGA, FC-HFBGA |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free and halogen-free status] | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Configuration Method | JTAG / Fast Passive Parallel / Active Serial | — |
| Number of LABs/CLBs | — | 14,144 |
| Total RAM Bits | — | 23,105,536 |
| Process Technology | — | 40 nm |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| PCI Express Support | — | Gen1 / Gen2 hard IP |
| Speed Grade | — | C3 |
| Design Tool | — | Quartus II |