EP4SGX360FH29C4N vs EP4SGX360FH29C3 Vergleich
Detaillierter Direktvergleich von EP4SGX360FH29C4N von Intel und EP4SGX360FH29C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FH29C4N | EP4SGX360FH29C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.850,00 | $1.395,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total Memory Bits | 23,105,536 | — |
| Number of User I/Os | 289 | — |
| Betriebstemperatur | 0C to 85C (commercial) | Commercial (0C to +85C) |
| Gehäuse | 780-FCBGA, FC-HFBGA (FH29) | 780-FCBGA (HBGA-780), 33 x 33 mm |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C4 (mid-tier) | C3 |
| Number of Transceivers | 24 (up to 8.5 Gbps) | — |
| Embedded Multipliers (18x18) | 1,288 | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 Hours) | — |
| Peak Reflow Temperature | 40 s max | — |
| RoHS-Status | Compliant / Lead-free | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 14144 LABs |
| Maximum User I/Os | — | 289 |
| Embedded Memory | — | 22.4 Mbits (M9K + M144K blocks) |
| Embedded 18x18 Multipliers | — | Up to 1,040 |
| Transceivers | — | Multi-gigabit serial transceivers (per device variant) |
| Memory Standards Supported | — | DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM II |
| Hard IP Blocks | — | PCIe Gen1/Gen2, CPRI, OBSAI, Serial RapidIO |