EP4SGX360FH29C4N vs EP4SGX360FH29C3 Comparación
Comparación detallada lado a lado de EP4SGX360FH29C4N por Intel y EP4SGX360FH29C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360FH29C4N | EP4SGX360FH29C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.850,00 | $1.395,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total Memory Bits | 23,105,536 | — |
| Number of User I/Os | 289 | — |
| Temperatura de funcionamiento | 0C to 85C (commercial) | Commercial (0C to +85C) |
| Encapsulado | 780-FCBGA, FC-HFBGA (FH29) | 780-FCBGA (HBGA-780), 33 x 33 mm |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C4 (mid-tier) | C3 |
| Number of Transceivers | 24 (up to 8.5 Gbps) | — |
| Embedded Multipliers (18x18) | 1,288 | — |
| Nivel de sensibilidad a la humedad (MSL) | 3 (168 Hours) | — |
| Peak Reflow Temperature | 40 s max | — |
| Estado RoHS | Compliant / Lead-free | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 14144 LABs |
| Maximum User I/Os | — | 289 |
| Embedded Memory | — | 22.4 Mbits (M9K + M144K blocks) |
| Embedded 18x18 Multipliers | — | Up to 1,040 |
| Transceivers | — | Multi-gigabit serial transceivers (per device variant) |
| Memory Standards Supported | — | DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM II |
| Hard IP Blocks | — | PCIe Gen1/Gen2, CPRI, OBSAI, Serial RapidIO |