EP4SGX360KF40C2 vs EP4SGX360HF35C2 Vergleich
Detaillierter Direktvergleich von EP4SGX360KF40C2 von Intel und EP4SGX360HF35C2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360KF40C2 | EP4SGX360HF35C2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.400,00 | $9.750,00 |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Gehäuse | 1517-ball FCBGA, 42.5 x 42.5 mm | — |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (Flip-Chip BGA) |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| LABs/CLBs | — | 14,144 |
| Number of I/O | — | 564 (max 532 user I/O) |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Cells | — | 353,600 |
| Transceivers | — | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) |
| Package Type | — | 1152-pin FC-FBGA |
| Package Code | — | HF35 (35x35 mm, 1.0 mm pitch) |
| Configuration | — | JTAG / Active Serial (external config device) |
| Design Tool | — | Quartus II / Quartus Prime |