EP4SGX360KF40C2 vs EP4SGX360HF35C2 Comparação
Comparação detalhada lado a lado de EP4SGX360KF40C2 por Intel e EP4SGX360HF35C2 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP4SGX360KF40C2 | EP4SGX360HF35C2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | NRND | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $10.400,00 | $9.750,00 |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | — |
| Temperatura de operação | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Encapsulamento | 1517-ball FCBGA, 42.5 x 42.5 mm | — |
| Tipo de montagem | Surface Mount (flip-chip BGA) | Surface Mount (Flip-Chip BGA) |
| Nível MSL | MSL3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Series | — | Stratix IV GX |
| Logic Elements (LEs) | — | 353,600 |
| LABs/CLBs | — | 14,144 |
| Number of I/O | — | 564 (max 532 user I/O) |
| Embedded Memory (bits) | — | 23,105,536 |
| Number of Logic Cells | — | 353,600 |
| Transceivers | — | Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) |
| Package Type | — | 1152-pin FC-FBGA |
| Package Code | — | HF35 (35x35 mm, 1.0 mm pitch) |
| Configuration | — | JTAG / Active Serial (external config device) |
| Design Tool | — | Quartus II / Quartus Prime |