EP4SGX360KF43C3 vs EP4SGX360KF43C2N Vergleich
Detaillierter Direktvergleich von EP4SGX360KF43C3 von Intel und EP4SGX360KF43C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360KF43C3 | EP4SGX360KF43C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8.905,55 | $1.975,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | 353,600 |
| Logic Array Blocks (LABs) | 14,144 | — |
| User I/O Pins | 880 | — |
| Total Embedded Memory | 23,105,536 bits | — |
| Transceivers | Embedded multi-gigabit transceivers | — |
| Maximum Transceiver Data Rate | 8.5 Gbps | — |
| DSP Blocks | Yes (hardware multipliers) | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Gehäuse | 1760-ball FC-BGA (FBGA-1760) | 1760-ball FC-FBGA (KF43) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Montageart | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS-Status | Compliant | Compliant |
| Series | — | Stratix IV |
| Adaptive Logic Modules (ALMs) | — | 14,144 |
| Logic Cells | — | 353,600 |
| Embedded Memory (bits) | — | 23,105,536 |
| User I/O Count | — | 880 |
| Core Voltage (Vcc) | — | 0.9 V |
| Process Node | — | 40 nm |
| Speed Grade | — | C2 |
| Temperature Grade | — | Industrial |
| MSL-Level | — | 3 (per JEDEC J-STD-020, 168 hours) |