EP4SGX360KF43C3 vs EP4SGX360KF43C2N Comparación
Comparación detallada lado a lado de EP4SGX360KF43C3 por Intel y EP4SGX360KF43C2N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360KF43C3 | EP4SGX360KF43C2N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8.905,55 | $1.975,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | 353,600 |
| Logic Array Blocks (LABs) | 14,144 | — |
| User I/O Pins | 880 | — |
| Total Embedded Memory | 23,105,536 bits | — |
| Transceivers | Embedded multi-gigabit transceivers | — |
| Maximum Transceiver Data Rate | 8.5 Gbps | — |
| DSP Blocks | Yes (hardware multipliers) | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Encapsulado | 1760-ball FC-BGA (FBGA-1760) | 1760-ball FC-FBGA (KF43) |
| Operating Temperature Grade | Commercial (C3) | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Estado RoHS | Compliant | Compliant |
| Series | — | Stratix IV |
| Adaptive Logic Modules (ALMs) | — | 14,144 |
| Logic Cells | — | 353,600 |
| Embedded Memory (bits) | — | 23,105,536 |
| User I/O Count | — | 880 |
| Core Voltage (Vcc) | — | 0.9 V |
| Process Node | — | 40 nm |
| Speed Grade | — | C2 |
| Temperature Grade | — | Industrial |
| Nivel MSL | — | 3 (per JEDEC J-STD-020, 168 hours) |