EP4SGX360NF45C2N vs EP4SGX360NF45C3 Vergleich
Detaillierter Direktvergleich von EP4SGX360NF45C2N von Intel und EP4SGX360NF45C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360NF45C2N | EP4SGX360NF45C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11.800,00 | $3.750,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Logic Array Blocks (LABs) | 14,144 | 14,144 |
| User I/Os | 920 | — |
| Embedded Memory Bits | 23,105,536 | — |
| Embedded Memory Type | M9K + MLAB | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage (VCCINT) | 0.9 V | — |
| Transceivers | Hard multi-gigabit transceivers up to 8.5 Gbps | Embedded multi-gigabit transceivers (GX) |
| PCI Express Hard IP | Gen1/Gen2 with x1/x2/x4 support | — |
| Speed Grade | -2 (commercial performance) | — |
| Betriebstemperatur | 0C to 85C (commercial, N suffix in legacy Altera marking) | Commercial (C3 speed grade) |
| Gehäuse | 1932-ball FC-FBGA | 1932-ball FC-FBGA (NF45) |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (flip-chip BGA) |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | — |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration | JTAG / Fast Passive Parallel / Active Serial (EPCS) | — |
| Embedded Memory (bits) | — | 23,105,536 |
| Maximum User I/O | — | 920 |
| Transceiver Data Rate | — | Up to 6.5 Gbps (per Stratix IV GX family) |
| Hard PCI Express Blocks | — | Yes (Gen1 / Gen2) |
| DSP Blocks | — | Dedicated variable-precision DSP blocks |
| Core Voltage | — | 0.9 V |
| RoHS-Status | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |