EP4SGX360NF45C2N vs EP4SGX360NF45C3 Comparação
Comparação detalhada lado a lado de EP4SGX360NF45C2N por Intel e EP4SGX360NF45C3 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP4SGX360NF45C2N | EP4SGX360NF45C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $11.800,00 | $3.750,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Logic Array Blocks (LABs) | 14,144 | 14,144 |
| User I/Os | 920 | — |
| Embedded Memory Bits | 23,105,536 | — |
| Embedded Memory Type | M9K + MLAB | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage (VCCINT) | 0.9 V | — |
| Transceivers | Hard multi-gigabit transceivers up to 8.5 Gbps | Embedded multi-gigabit transceivers (GX) |
| PCI Express Hard IP | Gen1/Gen2 with x1/x2/x4 support | — |
| Speed Grade | -2 (commercial performance) | — |
| Temperatura de operação | 0C to 85C (commercial, N suffix in legacy Altera marking) | Commercial (C3 speed grade) |
| Encapsulamento | 1932-ball FC-FBGA | 1932-ball FC-FBGA (NF45) |
| Tipo de montagem | Surface Mount (flip-chip BGA) | Surface Mount (flip-chip BGA) |
| Nível MSL | MSL3 (per JEDEC J-STD-020) | — |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration | JTAG / Fast Passive Parallel / Active Serial (EPCS) | — |
| Embedded Memory (bits) | — | 23,105,536 |
| Maximum User I/O | — | 920 |
| Transceiver Data Rate | — | Up to 6.5 Gbps (per Stratix IV GX family) |
| Hard PCI Express Blocks | — | Yes (Gen1 / Gen2) |
| DSP Blocks | — | Dedicated variable-precision DSP blocks |
| Core Voltage | — | 0.9 V |
| Status RoHS | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |