EP4SGX360NF45C2N vs EP4SGX360NF45I3N Vergleich
Detaillierter Direktvergleich von EP4SGX360NF45C2N von Intel und EP4SGX360NF45I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360NF45C2N | EP4SGX360NF45I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11.800,00 | $3.925,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | — |
| Logic Array Blocks (LABs) | 14,144 | — |
| User I/Os | 920 | — |
| Embedded Memory Bits | 23,105,536 | — |
| Embedded Memory Type | M9K + MLAB | — |
| Process Technology | 40 nm | TSMC 40 nm |
| Core Voltage (VCCINT) | 0.9 V | — |
| Transceivers | Hard multi-gigabit transceivers up to 8.5 Gbps | — |
| PCI Express Hard IP | Gen1/Gen2 with x1/x2/x4 support | — |
| Speed Grade | -2 (commercial performance) | I3 |
| Betriebstemperatur | 0C to 85C (commercial, N suffix in legacy Altera marking) | -40C to +100C (Industrial) |
| Gehäuse | 1932-ball FC-FBGA | 1932-ball FC-BGA (NF45) |
| Montageart | Surface Mount (flip-chip BGA) | — |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | — |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration | JTAG / Fast Passive Parallel / Active Serial (EPCS) | — |
| Logic Elements (LE) | — | 353,600 |
| Adaptive Logic Modules (ALM) | — | 141,440 |
| Embedded Memory (bits) | — | 23,105,536 |
| Maximum User I/O | — | 920 |
| Core Voltage (VCC) | — | 0.9 V |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Transceiver Count | — | 24 (GX) |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.0 mm |
| RoHS Compliance | — | Yes (lead-free) |