EP4SGX530HH35C4 vs EP4SGX530HH35I4 Vergleich

Detaillierter Direktvergleich von EP4SGX530HH35C4 von Intel und EP4SGX530HH35I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4SGX530HH35C4 EP4SGX530HH35I4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $3.120,00 $2.150,00
Series Stratix IV GX Stratix IV GX
Device Type FPGA FPGA - Field Programmable Gate Array
Logic Elements 531,200 531,200
Adaptive Logic Modules (ALMs) 21,248 LABs / 212,480 equivalent LEs —
Embedded Memory (bits) 28,033,024 28,033,024
Maximum User I/O Pins 564 —
Process Technology 40 nm —
Core Supply Voltage 0.9 V —
Gehäuse 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) 1152-BBGA, FCBGA (HBGA-1152), 42.5 x 42.5 mm
Speed Grade HH35 I4
Betriebstemperatur 0 C to 85 C (Commercial, -C4 suffix) 0C to 85C (Industrial)
Transceivers Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] —
DSP Blocks [DATA_NEEDED: block count for this density] —
PLLs 8 fractional PLLs —
Montageart Surface Mount (flip-chip BGA) Surface Mount
MSL-Level MSL3 (per BGA package standard) —
RoHS-Status Compliant Compliant
Logic Array Blocks (LABs) — 21,248
Maximum User I/O — 564
Number of Transceivers — 24
Transceiver Data Rate — 600 Mbps to 8.5 Gbps
Maximum Internal Frequency — 800 MHz
Embedded 18x18 Multipliers — 1,040
PLL Count — 4
Global Clock Networks — 16
Ball Pitch — 1.0 mm
Process Node — 40 nm TSMC
PCI Express Hard IP — Gen1/Gen2 x1/x4/x8

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