EP4SGX530HH35I3N vs EP4SGX530HH35C2N Vergleich
Detaillierter Direktvergleich von EP4SGX530HH35I3N von Intel und EP4SGX530HH35C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530HH35I3N | EP4SGX530HH35C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.200,00 | $3.500,00 |
| Family | Stratix IV GX | — |
| Device Type | FPGA - Field Programmable Gate Array | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 |
| Embedded Memory (bits) | 28,033,024 | — |
| Logic Blocks / LABs | 21,248 | — |
| Maximum User I/Os | 564 | — |
| DSP Blocks | 1,024 (18x18 multipliers) | — |
| Transceivers | 24 channels | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PLLs | 8 (fractional support) | — |
| Betriebstemperatur | -40C to +85C (industrial) | 0C to +85C (commercial) |
| Internal Frequency (max) | 800 MHz | — |
| Gehäuse | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1152-BBGA, FCBGA (FC-HFBGA) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | 3 | 3 |
| Process Node | 40 nm | — |
| Series | — | Stratix IV GX |
| Logic Elements (LE) | — | 531,200 |
| Embedded Memory | — | 28,033,024 bits |
| Logic Cells / LABs | — | 21,248 LABs |
| User I/O Pins | — | 564 |
| Package Size | — | 42.50 mm x 42.50 mm |
| Versorgungsspannung | — | 0.9 V (core) |
| Internal Frequency | — | 800 MHz (max) |
| Transceiver Data Rate | — | up to 8.5 Gbps |
| PCIe Hard IP | — | Gen1 / Gen2 |