EP4SGX530HH35I3N vs EP4SGX530KF43I3 Vergleich
Detaillierter Direktvergleich von EP4SGX530HH35I3N von Intel und EP4SGX530KF43I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530HH35I3N | EP4SGX530KF43I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.200,00 | $4.890,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 531,200 | — |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 |
| Embedded Memory (bits) | 28,033,024 | — |
| Logic Blocks / LABs | 21,248 | 21,248 (per Mouser listing) |
| Maximum User I/Os | 564 | — |
| DSP Blocks | 1,024 (18x18 multipliers) | 1,120 |
| Transceivers | 24 channels | Up to 24 (600 Mbps to 8.5 Gbps per Stratix IV GX family) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PLLs | 8 (fractional support) | — |
| Betriebstemperatur | -40C to +85C (industrial) | 0C to +85C (industrial) |
| Internal Frequency (max) | 800 MHz | — |
| Gehäuse | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1760-ball FCBGA (KF43), 42.5 x 42.5 mm |
| Montageart | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| MSL-Level | 3 | — |
| Process Node | 40 nm | — |
| Logic Elements (LE) | — | 531,200 |
| Embedded Memory Bits | — | 28,033,024 |
| User I/Os | — | 880 |
| Process Technology | — | 40 nm TSMC |
| Core Supply Voltage | — | 0.9 V |
| Internal Performance | — | Up to 800 MHz |
| Speed Grade | — | I3 (industrial, mid-speed) |
| PCIe Hard IP | — | PCI Express Gen1 / Gen2 |