EP4SGX530HH35I3N vs EP4SGX530KF43I3 Comparison
Detailed side-by-side comparison of EP4SGX530HH35I3N by Intel and EP4SGX530KF43I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX530HH35I3N | EP4SGX530KF43I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3,200.00 | $4,890.00 |
| Family | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array | β |
| Logic Elements | 531,200 | β |
| Adaptive Logic Modules (ALMs) | 21,248 | 21,248 |
| Embedded Memory (bits) | 28,033,024 | β |
| Logic Blocks / LABs | 21,248 | 21,248 (per Mouser listing) |
| Maximum User I/Os | 564 | β |
| DSP Blocks | 1,024 (18x18 multipliers) | 1,120 |
| Transceivers | 24 channels | Up to 24 (600 Mbps to 8.5 Gbps per Stratix IV GX family) |
| Transceiver Data Rate (max) | 8.5 Gbps | β |
| PLLs | 8 (fractional support) | β |
| Operating Temperature | -40C to +85C (industrial) | 0C to +85C (industrial) |
| Internal Frequency (max) | 800 MHz | β |
| Package | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch | 1760-ball FCBGA (KF43), 42.5 x 42.5 mm |
| Mounting Type | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| MSL Level | 3 | β |
| Process Node | 40 nm | β |
| Logic Elements (LE) | β | 531,200 |
| Embedded Memory Bits | β | 28,033,024 |
| User I/Os | β | 880 |
| Process Technology | β | 40 nm TSMC |
| Core Supply Voltage | β | 0.9 V |
| Internal Performance | β | Up to 800 MHz |
| Speed Grade | β | I3 (industrial, mid-speed) |
| PCIe Hard IP | β | PCI Express Gen1 / Gen2 |