EP4SGX530KF43C2N vs EP4SGX530KF43C3 Vergleich
Detaillierter Direktvergleich von EP4SGX530KF43C2N von Intel und EP4SGX530KF43C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP4SGX530KF43C3 - Stratix IV GX FPGA, 531K LE, 1760-BGA | Intel
EP4SGX530KF43C3 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP4SGX530KF43C2N | EP4SGX530KF43C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.450,00 | $3.700,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Series | EP4SGX530 | — |
| Logic Elements (LE) | 531,200 | — |
| Adaptive Logic Modules (ALM) | 212,480 | — |
| Logic Array Blocks (LAB) | 21,248 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: M9K/M144K block count] | — |
| Embedded Multipliers (18x18) | 1,920 | — |
| Transceiver Channels | 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| User I/Os | 880 | — |
| Core Voltage (VCCINT) | 0.9 V | — |
| Speed Grade | 2 (mid) | C3 |
| Betriebstemperatur | Commercial (0C to +85C) | — |
| Gehäuse | 1760-ball FCBGA (KF43) | 1760-ball FC-FBGA (KF43) |
| RoHS-Status | Compliant | Compliant (Pb-free) |
| Hard PCIe Gen2 IP | Yes | — |
| Process Node | 40 nm | — |
| Logic Elements | — | 531,200 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 28,033,024 bits (approximately 27.4 Mbits / 3,424 Kbits per block RAM array) |
| DSP Blocks (18x18 multipliers) | — | 880 |
| Maximum User I/O Pins | — | [DATA_NEEDED: pin count from KF43 BGA map] |
| Number of Transceivers | — | 24 (up to 8.5 Gbps per channel) |
| PLLs | — | 8 |
| PCIe Hard IP Blocks | — | 4 (Gen1/Gen2 capable) |
| Process Technology | — | 40 nm |
| Core Voltage (VCC) | — | 0.9 V |
| Betriebstemperaturbereich | — | 0C to +85C (commercial, 'C' suffix) |
| Montageart | — | Surface Mount (flip-chip BGA) |
| Configuration Method | — | Active serial (EPCS), passive serial, JTAG, Fast Passive Parallel |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |