EP4SGX530KH40C3 vs EP4SGX530KH40C4N Vergleich
Detaillierter Direktvergleich von EP4SGX530KH40C3 von Intel und EP4SGX530KH40C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530KH40C3 | EP4SGX530KH40C4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8.650,00 | $3.680,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Configurable Logic Blocks (CLBs) | 212,480 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (Mbits) | 28,033,024 / 8 ≈ 3,504 KBytes | — |
| Maximum User I/O | 744 | — |
| Transceivers | Up to 48 channels | 24 channels |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Hard PCIe Gen2 Endpoint | Yes | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: count] | — |
| PLLs | 12 (typical) | — |
| Gehäuse | 1517-BBGA, FCBGA | 1517-ball FCBGA (HBGA), 42.5 x 42.5 mm |
| Package Pin Count | 1517 balls | — |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) | — |
| Process Node | 40 nm CMOS | 40 nm |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C3 | — |
| RoHS-Status | Compliant | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Adaptive Logic Modules (ALMs) | — | 21,248 |
| Embedded Memory | — | 27,480 Kbits |
| User I/Os | — | 744 |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| DSP Blocks (18x18 Multipliers) | — | 1,288 |
| Phase-Locked Loops (PLLs) | — | 12 |
| Core Voltage | — | 0.9 V |
| Betriebstemperatur | — | 0 C to 85 C (Commercial) |
| Lead Free / RoHS | — | Yes / Compliant |