EP4SGX530KH40C3 vs EP4SGX530KH40C4N Comparación
Comparación detallada lado a lado de EP4SGX530KH40C3 por Intel y EP4SGX530KH40C4N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX530KH40C3 | EP4SGX530KH40C4N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8.650,00 | $3.680,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Configurable Logic Blocks (CLBs) | 212,480 | — |
| Embedded Memory (bits) | 28,033,024 | — |
| Embedded Memory (Mbits) | 28,033,024 / 8 ≈ 3,504 KBytes | — |
| Maximum User I/O | 744 | — |
| Transceivers | Up to 48 channels | 24 channels |
| Transceiver Data Rate | Up to 8.5 Gbps | — |
| Hard PCIe Gen2 Endpoint | Yes | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: count] | — |
| PLLs | 12 (typical) | — |
| Encapsulado | 1517-BBGA, FCBGA | 1517-ball FCBGA (HBGA), 42.5 x 42.5 mm |
| Package Pin Count | 1517 balls | — |
| Ball Pitch | 1.0 mm (typical for FCBGA-1517) | — |
| Process Node | 40 nm CMOS | 40 nm |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C3 | — |
| Estado RoHS | Compliant | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Adaptive Logic Modules (ALMs) | — | 21,248 |
| Embedded Memory | — | 27,480 Kbits |
| User I/Os | — | 744 |
| Max Transceiver Data Rate | — | 8.5 Gbps |
| DSP Blocks (18x18 Multipliers) | — | 1,288 |
| Phase-Locked Loops (PLLs) | — | 12 |
| Core Voltage | — | 0.9 V |
| Temperatura de funcionamiento | — | 0 C to 85 C (Commercial) |
| Lead Free / RoHS | — | Yes / Compliant |