EP4SGX530KH40I3 vs EP4SGX530KH40C3 Vergleich
Detaillierter Direktvergleich von EP4SGX530KH40I3 von Intel und EP4SGX530KH40C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530KH40I3 | EP4SGX530KH40C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12.500,00 | $8.650,00 |
| Series | Stratix IV GX | — |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | TSMC 40 nm | — |
| Logic Elements (LEs) | 531,200 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total Embedded Memory | 28,033,024 bits (28 Mb) | — |
| Number of LABs/CLBs | 21,248 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Maximum User I/Os | 744 | — |
| Transceivers | Up to 24 channels | Up to 48 channels |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| Core Voltage | 0.9 V | — |
| Temperature Grade | Industrial (I3) | — |
| Gehäuse | 1517-BBGA, FCBGA (FC-HFBGA), 40x40 mm | 1517-BBGA, FCBGA |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Family | — | Stratix IV GX |
| Logic Elements | — | 531,200 |
| Configurable Logic Blocks (CLBs) | — | 212,480 |
| Embedded Memory (bits) | — | 28,033,024 |
| Embedded Memory (Mbits) | — | 28,033,024 / 8 ≈ 3,504 KBytes |
| Maximum User I/O | — | 744 |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Hard PCIe Gen2 Endpoint | — | Yes |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: count] |
| PLLs | — | 12 (typical) |
| Package Pin Count | — | 1517 balls |
| Ball Pitch | — | 1.0 mm (typical for FCBGA-1517) |
| Process Node | — | 40 nm CMOS |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Speed Grade | — | C3 |