EP4SGX530KH40I3 vs EP4SGX530KH40C3 Comparação
Comparação detalhada lado a lado de EP4SGX530KH40I3 por Intel e EP4SGX530KH40C3 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP4SGX530KH40I3 | EP4SGX530KH40C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $12.500,00 | $8.650,00 |
| Series | Stratix IV GX | — |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | TSMC 40 nm | — |
| Logic Elements (LEs) | 531,200 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total Embedded Memory | 28,033,024 bits (28 Mb) | — |
| Number of LABs/CLBs | 21,248 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Maximum User I/Os | 744 | — |
| Transceivers | Up to 24 channels | Up to 48 channels |
| Max Transceiver Data Rate | 8.5 Gbps | — |
| Core Voltage | 0.9 V | — |
| Temperature Grade | Industrial (I3) | — |
| Encapsulamento | 1517-BBGA, FCBGA (FC-HFBGA), 40x40 mm | 1517-BBGA, FCBGA |
| Tipo de montagem | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Family | — | Stratix IV GX |
| Logic Elements | — | 531,200 |
| Configurable Logic Blocks (CLBs) | — | 212,480 |
| Embedded Memory (bits) | — | 28,033,024 |
| Embedded Memory (Mbits) | — | 28,033,024 / 8 ≈ 3,504 KBytes |
| Maximum User I/O | — | 744 |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Hard PCIe Gen2 Endpoint | — | Yes |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: count] |
| PLLs | — | 12 (typical) |
| Package Pin Count | — | 1517 balls |
| Ball Pitch | — | 1.0 mm (typical for FCBGA-1517) |
| Process Node | — | 40 nm CMOS |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Speed Grade | — | C3 |